Lapping/flattening plate for diamond / CBN sharpening stones (“bodrid”), 200 × 100 × 20 mm.

Aprašymas

It is also suitable for cleaning and opening up “loaded” stones with an organic bond (silicon carbide, aluminum oxide, bakelite bonds).
During dressing, it does not damage the diamond / CBN grains or tear them out of the bond, while very intensively renewing the bond surface layer.

Specifications:

• Dimensions: 200 × 100 × 20 mm

• Weight: 800 g

• Abrasive: aluminum oxide

• Bond: ceramic

• Grit size: JIS 170 grit; F-150